In the electronics market the simplification of processes is crucial for higher yield with lower costs and minimized risks. In order to support these key targets, Heraeus offers pre-soldered Condura?+ alumina substrates for die attachment.
This new material system combines Heraeus’ premium metal ceramic substrate with flux-free solder pads that have already been pre-applied. This simplifies the die soldering process dramatically since solder paste printing and flux residue cleaning are not required. Furthermore, since the solder material is just a metallic alloy and does not contain any solvent, solder splattering is avoided.
The special solder pads are positioned precisely at the correct location and are available in variable forms and volumes matching to the module design. Fixation dots deposited on the solder pads ensure that the dies do not move after placement. Upon reflow, the fixation material vaporizes without leaving any residue.
Heraeus’ highly trained field service engineers work closely with you to implement efficiently the pre-applied solder Condura?+ in your actual die attach process flow. In our application center, we support you from the design of your layout, through prototyping and testing, up to qualification. Contact us, we speak your language and understand your requirements.