Ribbon bonding is the most common interconnect method for microwave and RF MCMs. Ribbons of both precious and nonprecious metals exhibit good heat dissipation and low apparent resistance (impedance). Ribbon bonding takes advantage of the “skin effect” of high-frequency signals, which causes almost all of the flow to be on the surface.
Heraeus produces fine ribbons of gold, silver, platinum, and copper, as well as other metals on request. Gold bonding ribbon is especially suited for high-reliability applications such as microwave devices and in popular high-frequency applications. Our ribbons are typically custom-manufactured to exacting specifications. The resulting unrivalled uniformity of width minimizes snagging in bonding wedges. Many of our ribbons can also be plated with other metals.
Controlled high purity and defined additives are essential for producing ribbons with precise dimensions and the required mechanical characteristics and looping behavior. For best results, precursor metals with a high purity of 99.999% are doped with other substances. Heraeus Fine Bonding Ribbons have a homogeneous chemical composition, stable mechanical properties and clean, smooth surfaces. These products can help you meet the challenges of thermal management, miniaturization and weight reduction.